news

한어Русский языкEnglishFrançaisIndonesianSanskrit日本語DeutschPortuguêsΕλληνικάespañolItalianoSuomalainenLatina

in august, tsmc acquired innolux's tainan plant as a cowos production base, marking an important step in tsmc's ongoing competition with samsung electronics in the semiconductor packaging field. the acquisition is part of tsmc's broader strategy to maintain its market dominance. tsmc currently has a solid 62% market share with its advanced 2.5d packaging technology cowos.

according to industry insiders on september 1,samsung's device solutions (ds) division recently underwent organizational restructuring and staff expansion to strengthen its packaging competitiveness.the move comes as samsung faces growing challenges in the semiconductor foundry sector, especially in packaging, where tsmc has been strengthening its position for more than a decade.

samsung electronics has reorganized its advanced packaging (avp) business team into a development team and is actively recruiting experienced simulation, design and analysis professionals for r&d.an industry insider familiar with samsung's internal situation commented: "they are mobilizing immediately available solutions to strengthen packaging capabilities and expanding the organization to maximize synergies."

as circuit implementation in front-end processes reaches its limits, market demand for advanced packaging has surged. high-performance packaging technology is essential for ai chips required by large global technology companies such as nvidia, amd, and apple. tsmc's cowos technology maximizes connectivity between memory and logic semiconductors, giving it a competitive advantage in meeting these needs.

tsmc continues to invest heavily in the packaging field, plans to expand production capacity, and research next-generation technologies such as fo-plp. the industry predicts that tsmc will build two new plants next year, and packaging capacity will increase by up to 70%~80%.

according to market research firm techsearch, south korea's share of the global osat market was 4.3% last year, and taiwan ranked first with a share of 46.2%. samsung electronics is vigorously promoting turnkey services and fo-plp technology, but has not yet obtained important large customers.

an industry insider pointed out that “packaging is an area where tsmc has been strengthening its competitiveness for more than a decade, and it is still increasing its investment in advanced technologies.it will be difficult for samsung electronics to catch up overnight. to secure its foundry market share, samsung needs to accelerate and expand its packaging investment scale.”