news

한어한어Русский языкРусский языкEnglishEnglishFrançaisFrançaisIndonesianSanskritIndonesian日本語SanskritDeutsch日本語PortuguêsDeutschΕλληνικάPortuguêsespañolΕλληνικάItalianoespañolSuomalainenItalianoLatinaSuomalainenLatina

it house reported on october 4 that the industrial and commercial times published a blog post today (october 4), reporting that tsmc’s 2nm process technology is progressing smoothly and will continue to be mass-produced at its new baoshan, hsinchu, plant in 2025 as originally planned.

citing sources, it house revealed that the cost of research and development of advanced processes has increased exponentially, and the research and development cycle has continued to lengthen to 7 to 10 years. tsmc confirmed the 2nm process research and development path in 2016.

in addition, the cost of research and development of advanced processes continues to increase, which involves ip licensing, software verification, design architecture and other aspects. the research and development cost of 28nm is us$50 million, the 16nm process requires us$100 million, and the advancement to 5nm has reached us$550 million.

the investment in building related foundries is even greater. taking the 3nm process as an example, related r&d investment requires 4 billion to 5 billion us dollars, and building a 3nm process factory requires at least 15 to 20 billion us dollars.

the new manufacturing architecture requires the support of equipment, software (including ip, eda tools) and materials, and it is more difficult to improve yield.

the 2nm process puts forward higher requirements on all aspects, so these costs are directly reflected on the wafer. the average cost of a wafer is estimated to be more than 30,000 us dollars (it house note: currently about 211,000 yuan), which is routine twice the cost of 4nm and 5nm wafers.