news

한어Русский языкEnglishFrançaisIndonesianSanskrit日本語DeutschPortuguêsΕλληνικάespañolItalianoSuomalainenLatina

fast technology reported on september 3rd that according to media reports,the latest news from the supply chain shows that the launch time of the rtx 50 series graphics cards will be delayed than originally planned due to the need for re-tapeout (rto) to improve the yield, but there is no mention of when they will be released.

nvidia's blackwell uses tsmc's 4nm process technology and has 208 billion transistors, but the complex packaging method leads to yield issues.

although cowos-l packaging technology can provide a transmission speed of up to 10tbs, the packaging process requires extremely high precision, and any tiny defects may cause the valuable chips to be scrapped.

it was revealed that the coefficient of thermal expansion (cte) mismatch between gpu die, lsi bridge, rdl interposer and main substrate may lead to chip warping and system failure.

to solve these problems, nvidia had to redesign the top metal layer and bumps of the gpu chip, which not only affected the ai ​​chip, but also the upcoming rtx 50 series graphics cards.

supply chain sources also pointed out that chip design problems are not unique to nvidia. as chip sizes continue to expand, manufacturing complexity will inevitably increase.