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strong entry into the chip technology chain oriental crystal source pansys product launch

2024-09-02

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as chip manufacturing processes continue to approach physical limits, the continuation of moore's law will rely more on system-level optimization and process innovation. the chiplet system based on advanced packaging technology is another important way to obtain high-performance chips in addition to miniaturization of transistor size. however, chiplet system integration is not a simple stacking process, and its design faces huge challenges and difficulties. due to the dense arrangement of chiplets, electromagnetic, heat dissipation, and warping problems are prominent and interrelated. therefore, it is necessary to drive the chiplet system design through large-scale, accurate and efficient multi-physics field coupling simulation to predict and control the process, cost and yield.

aiming at the key demand for multi-physics simulation analysis in the optimization design of the above-mentioned core particle system, oriental crystal recently launched the multi-physics coupling simulation analysis tool pansys. the tool is embedded with an adaptive meshing engine and a high-performance multi-physics coupling solver designed specifically for the core particle system, and establishes an interface with the digital back-end design of the chip, automatically imports the core particle and its packaging design, and builds a high-fidelity multi-core integrated three-dimensional model, realizing efficient and accurate simulation calculation of the core particle system's thermal conduction, thermal mismatch, and warpage.

oriental crystal source pansys can be used for: (1) multi-physics coupling simulation of chip-particle system; (2) thermal-mechanical sensing chip-particle system layout design; (3) chip-particle system advanced packaging process tuning. core functions include:

supports 2.5d/3d-ic chip system integration design and seamlessly connects to mainstream eda design tools;

supports adaptive mesh generation and automatic mesh encryption of key parts;

supports steady-state and transient thermal-mechanical coupling analysis, and fluid-solid interface heat transfer analysis;

use cluster computing technology to achieve efficient multi-physics coupling simulation analysis of large-scale core-particle systems;

visual user interface gui and rich data post-processing and analysis functions.

the launch of pansys products will greatly improve the design efficiency of core particle systems, shorten the chip r&d cycle, and help the rapid development of the domestic core particle industry. at the same time, as a core particle system multi-physics field coupling simulation analysis eda tool with completely independent intellectual property rights, this product breaks the long-term monopoly of several major international eda giants in this field, and takes the lead in achieving breakthroughs in domestic eda tools in this field, ensuring the integrity and security of the domestic core particle technology chain. it is worth mentioning that in recent years, dongfang jingyuan has also fully utilized its long-term accumulation and technical advantages in the eda field, deeply participated in the formulation of core particle eda group standards, and promoted the development of the domestic core particle industry in various ways.

in the future, oriental jingyuan will use pansys products as a link to further strengthen cooperation with upstream and downstream of the industry chain, expand to the front-end design field, add multi-physics simulation to the design to consider process deviations, and formulate design plans with multi-physics perception; work closely with fab and equipment/material manufacturers to feedback design requirements to the manufacturing end. continue to deepen the technical route of design and manufacturing process collaborative optimization (dtco), thereby improving yield, reducing chip costs, promoting the development of integrated circuit manufacturing processes, and continuously consolidating the company's leading position in integrated circuit yield management.

source: shiyan evening news

(source: financial information)

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