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it house reported on october 4 that chip foundry tsmc and chip packaging company amkor announced on thursday that the two companies have signed a memorandum of understanding to cooperate in chip production, packaging and testing in arizona, usa. .

the companies said in a press release that the close proximity of their arizona factories will speed up the entire chip manufacturing process. under the agreement, tsmc will use amkor's turnkey advanced packaging and testing services at the new plant it plans to build in peoria, arizona. tsmc will use these services to support its customers, particularly those using tsmc's advanced wafer fabrication facilities in phoenix. the close cooperation between tsmc's front-end wafer manufacturing plant in arizona and amkor's nearby back-end packaging and testing plant will shorten the overall product production cycle.

apple confirmed last year that amkor would package apple silicon chips produced at a nearby tsmc plant, part of a shared desire to expand u.s. manufacturing. technology reporter tim culpan recently reported that tsmc's u.s. factories have begun small-scale production of the a16 chip, which debuted in the iphone 14 pro models two years ago and is also used in the iphone 15 and iphone 15 plus models.

apple previously confirmed that amkor will invest approximately us$2 billion in this project (it house note: currently approximately 14.072 billion yuan) and stated that it will employ more than 2,000 people after the project is completed.