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Voger Optoelectronics: Tonggewei and Arctic Xiongxin reached a strategic cooperation in the field of glass-based chiplet chip packaging

2024-08-26

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Securities Times e-company news, recently, Hubei Tongge Microcircuit Technology, a subsidiary of Voger Optoelectronics, reached a strategic cooperation agreement with Arctic Xiongxin. According to the relevant provisions of the agreement, the two parties will take "accelerating the commercialization of glass-based chips in chiplet chip packaging and other fields" as the core goal, and carry out research and development and various business cooperation in the fields of new generation IC semiconductors, glass-based AI computing chip packaging, glass-based high-bandwidth storage packaging, glass-based vehicle-mounted computing chip packaging, ultra-large chip interconnection and integrated circuit design. According to the information, Arctic Xiongxin has been incubated and developed by the Cross-Information Core Technology Research Institute founded by Academician Yao Qizhi of Tsinghua University in Xi'an High-tech Zone since 2018. The independently developed "Qiming 930" heterogeneous integrated AI acceleration chip has taken the lead in completing the process verification of the domestic chiplet packaging supply chain. It is reported that the two parties will jointly overcome the core technical difficulties such as glass-based high-performance computing chip packaging and large-size chip interconnection, and accelerate the commercialization of glass-based chips in chiplet chip packaging and other fields.
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