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Author: Wu Ruoyu

Editor: Peng Xiaoqiu

36Kr learned that on July 19, the TGV panel-level packaging line of Triassic (Guangdong) Technology Co., Ltd. ("Triassic") was officially put into production. It is the first fully automated production line for TGV panel-level packaging in China.

TGV board-level packaging production line

TGV (Through Glass Via) refers to the vertical electrical interconnection process through a glass substrate. It has the potential to replace silicon substrate material technology and is considered to be a key technology for the next generation of three-dimensional integration.

According to an Intel report, compared with traditional silicon-based and ceramic substrates, the spacing between glass through-holes can be less than 100μm, which increases the interconnection density between chips by 10 times; higher temperature tolerance also reduces deformation by 50%, increasing chip stability. Therefore, glass substrate chip packaging technology has become a key direction for next-generation chip packaging. It has attracted technology giants such as Intel, Samsung, and Apple to enter the market.

In 2022, Sanasic completed the wafer-level glass-based TGV pilot production line. The TGV board-level glass-based packaging pilot line put into production this time has a technical process that achieves 10μm aperture at the wafer level, 50:1 depth-to-diameter ratio, and 100% through-hole plating. The entire production line can produce 30,000 510*515mm glass packaging substrates per year. Sanasic has also become the only company in China that has both glass-based wafer and board-level packaging lines. Its main customers include China Electronics Technology Group Corporation, Schott Glass, Huawei, Konka Optoelectronics (SZ 000016), and BOE (SZ 000725).

TGV board-level packaging production line

Zhang Jihua, founder and chairman of Triassic, said that the research on TGV technology is synchronized at home and abroad. Judging from the technical indicators alone, China has made breakthroughs in 10-micron through-hole and filling technology for the first time, and is ahead of foreign manufacturers. At the same time, the field of advanced packaging is less affected by the "bottleneck" of foreign equipment, and China is expected to take the lead in this direction.

Triassic is a wholly-owned subsidiary of Chengdu Maike Technology Co., Ltd. Chengdu Maike has received strategic investments from Chengdu Technology Transfer, Chengdu Science and Technology Service, Academician Fund, Deer Laser (SZ 300776), and Yizhan Capital.

It is worth noting that the company is a research achievement transformation enterprise of the State Key Laboratory of Electronic Thin Films and Integrated Devices of the University of Electronic Science and Technology of China. Chairman Zhang Jihua is a professor and doctoral supervisor of the University of Electronic Science and Technology of China, and a doctor of the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences. The company's core team includes 1 national talent, 5 professors/senior engineers, 8 doctors, and more than 10 masters.

Hard Krypton learned that the domestic TGV industry chain is not mature, and there are still certain barriers to industrialization. However, the industry is in a booming period, attracting a large number of companies and capital to enter the market. Perhaps the next few years are the best time for TGV to achieve commercial mass production and take the lead in the industry.