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it home reported on september 26 that the korean media the elec published a blog post yesterday (september 25), reporting that the components related to the samsung w25 (china)/galaxy z fold special edition (korea) folding screen mobile phone have been produced in small batches.reliability testing is currently underway.

it is reported that the hdi substrate of samsung's w25 foldable screen mobile phone is provided by xinsen technology, and production has begun in its pcb factory in beijing, and it is expected to be launched in october this year.

samsung's w25 foldable phone, available only in china and south korea, drops the digitizer technology to reduce thickness and weight, but it still supports the s pen.

hdi substrate introduction

it home note: the full name of hdi is high density interconnect, which means high-density interconnect technology. it mainly uses blind/buried vias to improve the distribution density of pcb circuit boards.

about xinsen technology

the company was founded in 1993 and was formerly known as guangzhou quick circuit board co., ltd. a subsidiary of xinsen technology launched a project to acquire 100% equity of beijing ibiden in 2022. after the acquisition, ibiden has been renamed xinbiden and has been incorporated as its wholly-owned subsidiary.

the company responsible for the mass production of samsung w25 smartphone hdi this time is xingfei electric, which has completed the acquisition.