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Recently, the United Daily News quoted TSMC as saying that the company has received a total of NT$62.5 billion (about RMB 14 billion) in subsidies from mainland China and Japan since 2022. These subsidies will be used to finance its investments in Kumamoto and Nanjing, Japan.

In recent years, countries around the world have been competing to adopt financial subsidies to attract investment and build factories to promote the development of the semiconductor industry.

According to TSMC's financial data, in the first half of this year, TSMC received approximately NT$7.956 billion (approximately RMB 1.78 billion) in subsidies from mainland China and Japan, obtained approximately NT$47.545 billion (approximately RMB 10.6 billion) in government subsidies in 2023, and received NT$7.05 billion (approximately RMB 1.58 billion) in subsidies in 2022.

In August 2022, TSMC disclosed for the first time that its Nanjing Fab16 plant currently mainly manufactures chips with 12nm and 16nm processes. The Phase 1B 28nm process production line of the Nanjing plant expansion, namely TSMC Nanjing Fab 2, is expected to go into mass production in the second half of 2022.

At the TSMC Forum at the 2022 World Semiconductor Conference, the TSMC team detailed its latest progress and future plans in advanced processes, special processes (including the most advanced 3nm chips at the time and 2nm chips planned for mass production in 2025), advanced packaging technology, and expanded production capacity. As the world's largest chip foundry manufacturer, TSMC has become the main target of many countries for investment and factory construction.

TSMC is also actively expanding its business in the United States and Europe. On August 20, the company started construction of a 12-inch wafer factory in Germany. European Commission President Ursula von der Leyen attended the groundbreaking ceremony and said that the EU provided 5 billion euros (about 39.8 billion yuan) in government subsidies for the project.

In the United States, TSMC is building two advanced wafer fabs in Arizona and plans to build a third wafer fab, with a total investment expected to exceed US$65 billion. However, the United Daily News said that TSMC has not yet received the US$6.6 billion subsidy promised by the US government.

TSMC's Japanese subsidiary JASM's 12-inch wafer fab in Kumamoto was officially put into use on February 24 this year. The construction of JASM Kumamoto Plant II will also receive government subsidies and is scheduled to start construction at the end of 2024. With the operation of Kumamoto Plant II, the production capacity of the entire JASM Kumamoto Plant will reach 100,000 12-inch wafers per month, providing 6nm and 7nm process technologies.

In addition, Taiwanese media said that TSMC has informed its supply chain partners that it is considering building the "Kumamoto 3rd Plant" that can produce 3nm chips, and plans to start operations in 2027.

As global demand for high-end mobile phones and artificial intelligence grows, TSMC's revenue in the second quarter of this year was NT$673.5 billion (approximately RMB 150.7 billion), a year-on-year increase of 40.1%, and its net profit was NT$247.8 billion (approximately RMB 55.47 billion), a year-on-year increase of 36.3%.

According to Taiwanese media reports, TSMC declined to comment on specific customers and orders. However, the company disclosed that in the second quarter of 2024, sales generated by orders from its mainland China customers accounted for 16% of total wafer revenue, compared with 9% in the previous quarter.

As overseas investment will increase chipmakers' operating costs, TSMC said it will adopt a flexible pricing strategy based on rising overseas costs to achieve the long-term goal of a gross profit margin of no less than 53%.

This article is an exclusive article of Observer.com and may not be reproduced without authorization.