news

"Science and Technology Innovation Board Daily" August 9th (Reporter Wu Xuguang)"What is the progress of photoresist?" has always been one of the important topics that investors pay attention to in Bayi Space.

On the evening of August 7,Bayi Time and Space publicly stated that the company's research and development of photosensitive polyimide photoresist (PSPI) and fluorine-free photosensitive polyimide for semiconductor packaging is going smoothly and is currently in the pilot verification stage.

Market analysts generally believe that photosensitive polyimide photoresist (PSPI), as a new type of photoresist material, has great application potential in fields such as semiconductors and microelectronics packaging due to its excellent photosensitivity and thermal stability.

Regarding the research and development and latest progress of photosensitive polyimide photoresist (PSPI) products for semiconductor packaging,A person from the Secretary's Office of Bayi Space told the reporter of the Science and Technology Innovation Board Daily that the company's photosensitive polyimide photoresist (PSPI) project for semiconductor packaging is a new project proposed in 2023, focusing on the research and development and production of i-line photoresists, and its downstream is mainly aimed at display panels, semiconductor chips and other fields.

For subsequent production,The above-mentioned person from the Secretary's Office of Bayi Shikong said that the photosensitive polyimide photoresist (PSPI) products for semiconductor packaging are currently being verified with downstream customers. The specific results will depend on the matching degree between the relevant products and downstream customers and the stability of the batches.

“The semiconductor material certification cycle is relatively long, generally ranging from one to three years. If the progress is smooth, the subsequent production speed will be faster."The person from the Secretary's Office of Bayi Spacetime added.

Some practitioners in the field of photoresist believe that compared with achieving mass production and increasing performance in the short term,The layout of Bayi Time in the field of photosensitive polyimide photoresist (PSPI) for semiconductor packaging is more significant in that the company has proposed new products and technologies based on its original business, continuously expanded its new product category layout, and driven its performance to continue to improve.

The reporter of "Science and Technology Innovation Board Daily" noticed that photosensitive polyimide photoresist (PSPI) for semiconductor packaging is an important polymer material and plays an important role in advanced packaging and other links.Domestic listed manufacturers including Guofeng New Materials and Qiangli New Materials have also made arrangements.

but,Judging from the progress of related products of the aforementioned suppliers, the photosensitive polyimide photoresist (PSPI) products for semiconductor packaging of Guofeng New Materials and Qiangli New Materials are still in the research and development and verification stage and have not yet been mass-produced.

On August 8, a person from the Secretary's Office of Guofeng New Materials responded to a question from a reporter from the Science and Technology Innovation Board Daily and said that the photosensitive polyimide photoresist (PSPI) related products for semiconductor packaging jointly developed by the company and the Advanced Research Institute of USTC are still in the research and development stage and are being promoted as planned, but have not yet been mass-produced.

Prior to this, on June 21, Qiangli New Materials stated on its investor interaction platform that the company's advanced packaging materials include photosensitive polyimide, etc., and are currently in the customer certification stage.

It should be pointed out that compared with the semiconductor packaging field, domestic photosensitive polyimide photoresist (PSPI) has achieved mass production in the display panel field.

On July 16, Dinglong Co., Ltd. stated in an interview with institutional investors that the company's semiconductor display material PSPI business has been sold in batches to mainstream domestic panel factory customers. Among them, PSPI products have become the first supplier for some mainstream domestic panel customers, establishing a leading position in domestic supply of related products.

Regarding the reason why domestic photosensitive polyimide photoresist (PSPI) has not been mass-produced in the field of semiconductor packaging, the aforementioned photoresist practitioner said in an interview with the "Science and Technology Innovation Board Daily" reporter that the current mainstream photoresist used in China is still mainly ArF photoresist, which can be used in chip manufacturing fields with different maturity and performance requirements.Photosensitive polyimide photoresist (PSPI) is a research direction for the future, but there is still a long way to go before it can be industrialized.。

"alsoFrom a technical perspective, the technical difficulty of photosensitive polyimide photoresist (PSPI) in the industrialization process lies in whether its clarity in edge lithography can meet market requirements.‌” said a person working in the photoresist field.

“Currently, the market prospects of photosensitive polyimide photoresist (PSPI) are still uncertain.However, as a new material, photosensitive polyimide photoresist (PSPI) has become a consensus in terms of performance, from early research and development to industrialization and localization substitution. "The aforementioned market analyst said.