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Source: Huanqiu.com

[Global Network Technology Comprehensive Report] On July 18, according to the latest news released by the famous Apple analyst Ming-Chi Kuo, Apple has decided to postpone its plan to use new resin-coated copper foil (RCC) components in the iPhone again. The technology was originally expected to debut in the iPhone 16 and then postponed to the iPhone 17, but now it seems that the iPhone 17 will also miss out on this innovative technology.

RCC technology has attracted much attention for its ability to significantly reduce the thickness of the motherboard and save internal space. In his analysis last October, Guo Mingchi pointed out that RCC does not contain glass fiber, making the drilling process easier and is expected to bring revolutionary changes to the internal design of the iPhone.

Despite the many advantages of RCC technology, Apple and its suppliers face challenges in durability and fragility when using the material. Guo Mingchi mentioned that it is precisely because of these quality issues that they cannot meet Apple's high standards for products that the plan to adopt RCC components on the iPhone 17 was forced to shelve.

Although RCC technology has not been applied to the iPhone 17 as expected, the potential advantages it brings to the internal design of the iPhone are still worth looking forward to. If Apple can solve the durability problem of RCC in the future, users may see a thinner iPhone body, or Apple will use the additional space to explore other innovative designs.