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it home reported on september 5 that trendforce published a blog post today (september 5) that with more and more participants, the flip chip ball grid array (fcbga) substrate industry is booming.

about fcbga

fcbga (flip chip ball grid array) is a packaging technology that inverts the chip and connects it to the packaging substrate, and then uses ball solder joints to fix the package to the substrate.

fcbga first appeared in the early 1990s. in 1997, intel applied fcbga packaging technology to processors for the first time, which was an important milestone in the history of fcbga technology.

in 1999, intel launched the first chip using fcbga packaging technology, the pentium iii 500 processor.

the advantages of fcbga packaging technology mainly include:

higher density: because fcbga packaging technology can install more chip pins in the same packaging area, it can achieve higher integration and smaller packaging size.

better heat dissipation: fcbga allows the chip to be directly connected to a heat sink or heat sink, thereby improving the efficiency of heat transfer.

higher reliability and electrical performance: because it can reduce factors such as resistance and capacitance between the chip and the substrate, thereby improving the stability and reliability of signal transmission, it can also improve the speed and accuracy of signal transmission.

fcbga packaging technology has the advantages of high integration, small size, high performance and low power consumption.fcbga is suitable for many types of chips. it is commonly used in high-performance chips such as cpus, microcontrollers and gpus. it is also suitable for network chips, communication chips, storage chips, digital signal processors (dsps), sensors, audio processors, etc.

image source: toppan

the market started to flourish

samsung electro-mechanics estimates that by 2026, the sales share of its high-end flip chip ball grid array (fcbga) substrates for servers and artificial intelligence will exceed 50%.

trendforce believes that after a long period of inventory reduction, the balance between semiconductor supply and demand has improved and market demand has gradually recovered.

globally, idm companies such as micron, infineon and nxp have conducted extensive research and development in the field of fcbga packaging, while professional packaging and testing companies such as ase group, jcet and amkor have also developed various fcbga technologies.

sources said that many large international semiconductor companies including intel, qualcomm, nvidia, amd and samsung are using fcbga technology.

data shows that the global fcbga packaging technology market will continue to grow rapidly in the next few years, and the market size is expected to exceed us$20 billion by 2026 (it home note: currently approximately rmb 142.394 billion).

faced with such a promising opportunity, more and more companies are beginning to step up their efforts to develop fcbga packaging technology and continuously promote its innovation and upgrading.