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Equipped with Samsung Electronics HBM3E 12H memory, Korean Rebellions is expected to release the next generation AI chip in 2024

2024-08-23

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IT Home reported on August 23 that according to Korean media ZDNet Korea, Oh Jin-wook, chief technology officer of South Korean fabless AI chip design company Rebellions, said in an interview that its next-generation AI NPU chip REBEL is expected to be released in 2024.

▲ Atom NPU previously launched by Rebellions

REBEL is designed to accelerate large language models and multimodal models. It uses Samsung + Samsung's process and memory combination: Samsung 4nm process + Samsung HBM3E 12H memory. In addition, the REBEL chip will also support 800Gb Ethernet.

The REBEL family consists of two products, REBEL-Single based on a single chip and REBEL-Quad consisting of 4 chiplets, equipped with 1 and 4 HBM3E 12H memory stacks respectively. REBEL-Quad can accelerate large models with parameter size of up to 175B+.

Oh Jin-wook said the company plans to release REBEL-Single this year; as for the larger REBEL-Quad, thanks to the active support of Samsung Electronics, the launch time is expected to be advanced from around 2026 to early 2025.

On the 18th of this month, Rebellions signed a final merger agreement with SAPEON Korea, another AI semiconductor design company under South Korea's SK Group.

After the merger, SAPEON Korea will become the surviving entity but its name will be changed to Rebellions. At the same time, the new Rebellions will be led by Park Sung-hyun, the current CEO of Rebellions. The valuation of the new Rebellions is expected to exceed 1 trillion won (IT Home Note: Currently about 5.33 billion yuan).

Oh Jin-wook said:

SAPEON and Rebellions are both NPU developers, but they have different business models and partners, so they have different perspectives. The new company after the merger will combine the advantages of both parties to develop better solutions.