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Jinghe Integrated Circuit continues to accelerate its progress in CMOS image sensor (hereinafter referred to as CIS) products. Recently, Jinghe Integrated Circuit and domestic advanced design company SmartSens jointly launched the industry's first 180 million pixel full-frame (2.77-inch) CIS, providing more choices for image sensors used in high-end SLR cameras and pushing full-frame CIS into a new stage of development.

(Product Image)

To meet the industry requirements of 8K high-definition, the demand for high-performance CIS is increasing day by day. Based on the self-developed 55-nanometer process platform, Jinghe Integrated cooperated with SmartSens to jointly develop photolithography splicing technology, overcoming the difficulties of splicing precision control and yield improvement in pixel columns, and successfully breaking through the limit of a conventional mask that can be covered on a single chip size, while ensuring that the electrical and optical performance of the spliced ​​chip is still consistent in the nano-level manufacturing process.

(Sample photos taken)

The successful trial production of the first 180-megapixel full-frame CIS not only marks the successful application of photolithography stitching technology in the field of large-format sensors, but also paves the way for the development of more large-format full-frame and medium-format sensors in the future. At the same time, the product has many leading features such as 180-megapixel ultra-high-pixel 8K 30fps PixGain HDR mode high frame rate and ultra-high dynamic range, innovatively optimized optical structure, compatible with different optical lenses, and improved product adaptability in terminal applications, breaking Sony's long-term monopoly in the field of ultra-high-pixel full-frame CIS in Japan and contributing to the development of local industries.