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On August 6, SK Hynix announced that the company and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms (PMT). Based on the U.S. CHIPS and Science Act, SK Hynix will receive a direct subsidy of up to US$450 million and a loan of up to US$500 million for its investment in an advanced semiconductor packaging plant in Indiana, USA.

In addition, the US Treasury Department decided to provide SK Hynix with a tax credit of up to 25% of its investment in the United States.

SK Hynix is ​​currently successfully mass-producing AI-oriented memory in Indiana, the United States, and will proceed with factory construction as scheduled.

According to official introduction, SK Hynix announced in April this year that it will invest US$3.87 billion to build an advanced packaging plant in Indiana, the United States, creating about 1,000 jobs. It will also work with local research institutions such as Purdue University to carry out semiconductor research and development.