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Redmi K70 Extreme Edition is scheduled to be released on July 19th and will be equipped with four Xiaomi self-developed chips

2024-07-16

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【Pacific Technology News】The latest news today is that Xiaomi announced that the Redmi K70 Extreme Edition will be released on July 19 and will be on sale as soon as it is released. The core configuration is equipped with the Dimensity 9300+ chip, the first generation of Huaxing Optoelectronics 1.5K C8+ straight screen, and the screen bracket is cancelled and equipped with a right-angle metal frame. It is equipped with four Xiaomi self-developed chips, namely the P2 fast charging chip, the G1 power management chip, the T1 signal enhancement chip, and the D1 independent display chip.


The front adopts an ultra-narrow visual four-sided design. The upper border and left and right borders are all 1.7mm, and the lower border is 1.9mm. It has a rear 50-megapixel main camera and supports OIS optical image stabilization.

Pengpai P2 enables the phone to support faster 120W second charging and reverse charging. T1 is a WIFI chip. According to official data, WiFi performance is improved by 12%, GPS navigation performance is improved by 20%, and 5G Wi-Fi omnidirectional performance is improved by up to 58%. G1 is first installed on Xiaomi 12S Ultra, which can monitor the battery status in real time. The specific improvements can be divided into battery health, accurate prediction, and battery life improvement.

The main highlights of the latest self-developed D1 chip have been made public. It is equipped with a self-developed AI super vision engine and supports a self-developed dynamic super-frame super-resolution algorithm. It can independently handle graphics rendering tasks and reduce the burden on the main processor (SoC), thereby improving the game frame rate and picture quality, while reducing power consumption and enhancing the overall gaming experience.

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