news

한어Русский языкEnglishFrançaisIndonesianSanskrit日本語DeutschPortuguêsΕλληνικάespañolItalianoSuomalainenLatina

the russian ministry of industry and trade and istc miet have developed a large-scale plan for import substitution of electronic product production equipment by 2030.

the new plan sets domestic 65-nanometer technology to be realized in 2030.

image source: smee

according to cnews, russia has allocated more than 240 billion rubles ($2.54 billion) to support a large-scale plan to replace foreign chip manufacturing equipment by 2030.

the plan involves launching 110 research and development projects to reduce reliance on imported fab equipment and eventually adopt 28-nanometer process technology to manufacture chips. putting the $2.54 billion figure together, that's 57 times less than what the country will spend on defense in its war with ukraine in 2025.

extensive plan to localize chip manufacturing

russian chipmakers - angstrem, mikron, etc. - can produce chips at various mature nodes, including 65nm and 90nm.of the 400 tools used for chips in russia, only 12% can currently be manufactured locally.sanctions further complicate the situation, with the cost of critical equipment rising by 40%-50% because it must be smuggled into the country. in order to reduce costs and reduce dependence on foreign tools, the russian ministry of industry and trade (minpromtorg) and the ministry of trade and miet (a government-controlled company) have developed a plan focused on developing approximately 70% of the equipment required for microelectronics production and domestic substitutes for raw materials.

the program covers all aspects of chip manufacturing, including actual tools, raw materials and electronic design automation (eda) tools. the project will develop "20 different technology routes" such as microelectronics, microwave electronics, photonics and power electronics from 180nm to 28nm. some of the developed technologies will also be used in photomask production and electronic module assembly.

the goal is very vague

while the strategic goals of the plan seem clear (localizing 70% of chipmaking tools and raw materials for $2.54 billion by 2030), the details look rather hazy, to say the least.

one of the important milestones expected to be achieved in russia by the end of 2026 is the development of lithography equipment for 350nm and 130nm process technologies (this is a huge difference, since there are several nodes between 350nm and 130nm nodes) and for 150nm electron beam lithography equipment at the production node.in addition, russia plans to develop chemical vapor deposition epitaxy equipment within a few years. additionally, by the end of 2026, the russian ministry of industry and trade hopes that the domestic semiconductor industry will be able to produce silicon ingots and cut them into wafers.

by 2030, russia aims to produce domestic lithography systems capable of processing wafers in 65nm or 90nm process technologies. this will significantly increase the country's ability to produce microelectronics, but will still lag the industry by 25-28 years.

this new plan is decidedly less ambitious than the one released a year ago, which targeted 28nm for 2027 and 14nm manufacturing processes for 2030 (which could be achieved using advanced technology that the russian government believed it could acquire from global leaders last year). to explain this fact). however, judging by the number of tools planned to be developed over the next few years (no word on volume production), the plan is ambitious enough.

the program envisages the development of various types of equipment, including 15 types of control and measurement equipment, 13 types of plasma chemistry devices, 10 types of photolithography systems, 9 types of chip packaging tools, 8 types of photomask manufacturing tools, 7 types of wafer production tools wait.