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tsmc's first asml high naeuv lithography system is expected to be delivered in september

2024-09-09

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it home reported on september 9 that according to taiwan media economic daily this afternoon, citing industry sources, tsmc's first asml high na euv lithography system equipment will be delivered this month, which will enable it to "continue to lead" samsung's wafer foundry delivery progress.

the value of this equipmentmore than 400 million euros(it home note: currently about 3.148 billion yuan), its height exceeds that of a conference room, its length far exceeds that of the previous generation of equipment, and its specificationsspecial and precisetherefore, local highways connecting to airports or ports are expected to require traffic control, or arrange for delivery to the factory during specific late night hours to avoid traffic congestion.

in response to industry rumors, asml said today that it "does not comment on a single customer." tsmc also mentioned in the evening that it does not respond to market rumors. however, it is widely rumored in the industry that tsmc's first high na euv will be shipped this month.moved into tsmc's global r&d centerused for research and development to meet the needs of subsequent advanced process development.

according to previous reports from it home, korean media reported in august this year that samsung will launch the first quarter of 2025 between the fourth quarter of 2024 and the first quarter of 2025.installthe first high-na euv lithography machine from asml will be installed and is expected to be put into use in mid-2025