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it home reported on september 6 that micron stated in a technical blog released this month that its "production-capable" 12-layer stacked hbm3e 36gb memory is now being delivered to major industry partners for verification in the entire ai ecosystem.

micron said that its 12-layer stacked hbm3e capacity is 50% higher than the existing 8-layer stacked hbm3e products, allowing large ai models such as llama-70b to run on a single processor, avoiding the latency issues caused by multi-processor operation.

micron's 12-layer stacked hbm3e memory has an i/o pin rate of 9.2+ gb/s and can provide 1.2+ tb/s of memory bandwidth. micron also claims that this product consumes significantly less power than its 8-layer stacked hbm3e competitor.

hbm3e is not an isolated product, but is integrated into the ai ​​chip system, which relies on the cooperation of memory suppliers, product customers and osat companies. micron is a partner member of tsmc's 3dfabric advanced packaging alliance.

dan kochpatcharin, director of tsmc’s ecosystem and alliance management division, recently stated:

tsmc and micron have maintained a long-term strategic partnership. as part of the oip ecosystem, we work closely together to enable micron's hbm3e-based system and cowos packaging designs to support customers' ai innovations.