news

한어Русский языкEnglishFrançaisIndonesianSanskrit日本語DeutschPortuguêsΕλληνικάespañolItalianoSuomalainenLatina

According to the information released by Tianyancha APP on August 6, Core Interconnect Technology (Qingdao) Co., Ltd. announced its C round of financing with a financing amount of 300 million yuan. Institutions participating in the investment include CICC Capital, Zengcheng Industrial Investment Group, and Zhongshan Torch Development Zone Science and Technology Innovation Industry Fund.

The historical financing of Core Interconnect Technology (Qingdao) Co., Ltd. is as follows:

Core Interconnect was founded in 2018 and has R&D centers in Beijing, Qingdao, Shanghai, and Shenzhen. It is a national high-tech enterprise focusing on the design of mixed-analog signal chain chips. The team has gathered industry elites with rich experience in R&D and mass production. In the past few years, it has rapidly launched hundreds of chip products including high-precision data converters (AD/DA), voltage reference sources, clock generators, clock buffers, operational amplifiers, etc. Related products have been used in batches in hundreds of companies in the fields of power, rail transit, and intelligent manufacturing. Core Interconnect will continue to provide customers with high-precision, high-integration, and high-stability chip products, forming a one-stop signal chain solution company with ADC, DAC, clock chips, op amps, high-speed SerDes, isolation devices, and mixed-analog SoCs as the core.

Data source: Tianyancha APP

The above content is compiled by Securities Star based on public information and generated by algorithms (Net Information Computing No. 310104345710301240019), which has nothing to do with the position of this website. If there are any problems with the data, please contact us. This article is a data compilation and does not constitute any investment advice to you. Investment is risky, please make decisions with caution.