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IT Home reported on July 16 that on July 16, Samsung announced that it had successfully completed the verification of the world's fastest mobile memory 10.7 gigabits/second (Gbps) LPDDR5X DRAM on MediaTek's next-generation Dimensity flagship mobile platform.

Samsung's 10.7Gbps LPDDR5X is reported to have about 25% lower power consumption and about 25% higher performance than its predecessor. This can extend the battery life of mobile devices and enhance device-side AI performance, thereby increasing the speed of AI functions (such as voice-to-text generation) without the need for server or cloud access.

The verification of the 10.7Gbps operating speed was conducted using Samsung's 16GB LPDDR5X package specification based on MediaTek's Dimensity 9400 flagship mobile platform, which is scheduled to be released in the second half of the year. Samsung said that the two companies maintained close cooperation and completed the verification in just three months.

Dimensity flagships over the years have supported the latest top memory specifications. For example, in August last year, LPDDR5T completed performance verification on the Dimensity 9300 flagship mobile platform with a rate of up to 9.6Gbps. As early as 2021, the Dimensity 9000 took the lead in completing the verification of LPDDR5X memory.

What is certain at the moment is that the Dimensity 9400 will be the first to support Samsung's LPDDR5X 10.7Gbps, making it the world's fastest mobile phone memory, with both memory and cache specifications maxed out.

“Through our collaboration with Samsung Electronics, MediaTek’s next-generation Dimensity flagship mobile platform is the first to be validated at Samsung’s LPDDR5X speeds of up to 10.7Gbps, bringing amazing AI capabilities and mobile performance to upcoming devices,” said Dr. Jingquan Xu, Senior Vice President and General Manager of Wireless Communications Business Unit at MediaTek.

According to previous leaks, the Dimensity 9400 will use ARM's latest CPU architecture, codenamed BlackHawk. In addition, MediaTek is deeply involved in the architecture design of ARM v9's latest generation IP Blackhawk, and the new architecture will have significant improvements. The Dimensity 9400 will also first use TSMC's new generation 3nm process, and will continue to optimize power consumption based on the previous generation, and then use Blackhawk to improve performance + CPU cache, greatly improving design performance and energy efficiency.

In addition, according to previous reports, this year's MediaTek Dimensity 9400 chip will still be an all-big-core design, with a strong CPU foundation, cache and APU. The all-big-core will win at the starting line, and it is expected to debut at the end of the year.