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Huawei raised funds again.

On August 12, Huawei Investment Holding Co., Ltd. issued an announcement on the issuance of the fourth tranche of ultra-short-term financing bonds in 2024. The total issuance amount of this bond is 4 billion yuan, the interest rate is 1.6%, and the term is 130 days. The total issuance of ultra-short-term financing bonds has reached 13 billion yuan so far this year.

The prospectus for the fourth tranche of ultra-short-term financing bonds in 2024 released by Huawei shows that in order to support the development of various businesses and the implementation of key strategies, this issuance of 4 billion yuan of ultra-short-term financing bonds will be used to supplement the operating capital of the company's headquarters and its subsidiaries.

The fourth issuance of short-term bonds

This year, Huawei Investment Holding Co., Ltd. (hereinafter referred to as "Huawei") has issued ultra-short-term financing bonds for the fourth time.

Huawei announced that it has recently completed the issuance of the fourth ultra-short-term financing bills in 2024. This bond is referred to as "24 Huawei SCP004", with an issuance amount of 4 billion yuan, an interest rate of 1.6%, a term of 130 days, an interest accrual date of August 9, 2024, and a redemption date of December 17, 2024.