news

한어Русский языкEnglishFrançaisIndonesianSanskrit日本語DeutschPortuguêsΕλληνικάespañolItalianoSuomalainenLatina

"Science and Technology Innovation Board Daily" August 7th (Reporter Chen Mei)Recently, there is news that 3D design software manufacturer Qunhe Technology plans to conduct an initial public offering (IPO) in Hong Kong as early as this year, and the expected fundraising scale may reach US$200 million. At present, the company has hired CCB International and JPMorgan Chase as underwriters to advance the listing plan.

In response, Qunhe Technology told the reporter of Science and Technology Innovation Board Daily that it would “not comment.”

Previously, Qunhe Technology submitted an application for listing to the U.S. Securities and Exchange Commission in June 2021. However, in November of the same year, a reporter from the Science and Technology Innovation Board Daily learned that Qunhe Technology was considering changing its listing location from the United States to Hong Kong and received an additional investment of US$200 million. At that time, an investor familiar with Qunhe Technology revealed that "this round of additional investment was mainly followed by existing shareholders."

According to data from Cailianshe Venture Capital, Qunhe Technology completed Pre-IPO financing of US$200 million in November 2021.

During the exchange, another person familiar with the matter said, "Qunhe Technology is indeed applying for an IPO, but the latest progress is not clear at present."

IDG, GG Ventures, Shunwei Capital, and Hillhouse Capital hold nearly 50% of the shares

Qunhe Technology was founded in 2011.Huang Xiaohuang, Chen HangandZhu HaoIt was co-founded by three people who were graduate students at UIUC (University of Illinois at Urbana-Champaign).