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Lu Weibing shows off Xiaomi Mi MIX Fold 4 for the first time: revealing three core technological breakthroughs

2024-07-17

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According to Fast Technology on July 17, Xiaomi MIX Fold 4 will be officially released on July 19. The phone will be Xiaomi's most advanced, sophisticated, and lightest full-configuration large-folding screen flagship ever.

Recently, Lu Weibing, President of Xiaomi Group, released a video, showing the real Xiaomi MIX Fold 4 for the first time, and introduced the core technology and three major breakthroughs of the new phone.

In terms of appearance, Lu Weibing demonstrated a blue MIX Fold 4. The camera module is pure black, the overall shape is rounded, and it uses a Leica quad-camera. The Leica logo and flash are on the right.


According to Lu Weibing, the first breakthrough of Xiaomi MIX Fold 4 is the use of a new generation of keel hinge, which allows the folding screen to break through the limit of lightness and thinness, and is 34% smaller than the previous generation. Lu Weibing described it as Xiaomi's thinnest, Xiaomi's narrowest, Xiaomi's strongest, and Xiaomi's most precise.


The second breakthrough is the new phone’s all-carbon structure. The hinge floating plate, screen lining, and battery compartment lining are all made of 100% carbon fiber.

It is understood that Xiaomi MIX Fold 4 uses T800H high-strength carbon fiber with an area of ​​up to 33552mm², a tensile strength of 5500MPa, and an impact strength increased by 300%. The weight of the same volume is only 1/15 of that of the previous flagship aluminum alloy material.

The last breakthrough is the three-layer, five-sided stacked motherboard, which is smaller in size and has higher stacking efficiency. It is a very sophisticated process upgrade.


As the most powerful folding screen in Xiaomi's history, Xiaomi MIX Fold 4's core technology and technological breakthroughs are definitely not limited to this. At the press conference on the 19th, Lei Jun will also give a comprehensive explanation, which is worth looking forward to.